Enclosure for hermetical encapsulated electronics
US9801303B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 24, 2013 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Sep 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20563
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is an enclosure for encapsulating one or more printed circuit boards (PCBs) configured for having electronic devices mounted thereon. The enclosure includes a main chassis body including a bottom portion and an outer wall including connectable panels for encasing the main chassis body. The enclosure also includes a top portion configured for completing a seal between the main chassis body and the outer wall, wherein one of the PCBs forms one of the connectable panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.