Apparatus and method for a molded plastic fin shell for electronic devices
US9802279B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2013 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | May 10, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments are provided for using a molded thermal plastic fin shell as part of a heat sink design for electronic devices. The heat sink design also includes metal components in contact with the electronics components of the device and the thermal plastic fin shell. The thermal plastic fin shell serves both as part of the heat sink design to dissipate heat to the air and as a protective casing or packaging for the device. The heat is transferred from the electronics components or heat sources in the device to the heat sink metal components and hence to the thermal plastic fin shell in contact with the metal. The thermal plastic fin shell dissipates the heat into the surrounding air. The combination of metal and thermal plastic materials in the heat sink design combines both desired properties of high thermal conductivity and ease of manufacture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.