Methods for fabricating a chemical-mechanical polishing composition
US9803106B2 · kind B2 · utility
2Cited by
13References
20Claims
0Family size
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Key dates
| Filing date | Jun 25, 2015 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Oct 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Methods for fabricating a chemical-mechanical polishing composition include growing colloidal silica abrasive particles in a liquid including an aminosilane compound such that the aminosilane compound becomes incorporated in the abrasive particles. A dispersion including such colloidal silica abrasive particles may be further processed to obtain a chemical-mechanical polishing composition including colloidal silica particles having the aminosilane compound incorporated therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.