Thermal interface material and method of making and using the same
US9803125B2 · kind B2 · utility
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17References
23Claims
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Key dates
| Filing date | Apr 27, 2016 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Apr 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface material comprises a polymeric elastomer material, a thermally conductive filler, and a coupling agent, along with other optional components. In one exemplary heat transfer material, a coupling agent having the formula:where Y is either a cyclic structure or Y is represented by Formula II:where:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.