Post processing of components that are laser peened
US9803258B2 · kind B2 · utility
2Cited by
10References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 13, 2012 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Aug 19, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49336
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of post processing a laser peened component to remove a laser remelt layer is proposed. The post processing includes a series of steps including grit blasting, chemical etching and mechanical finishing the component. This will ensure that the mechanical property (i.e., damage tolerance) benefit of laser peening is restored to the surface of the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.