Liquid cooling
US9803937B2 · kind B2 · utility
6Cited by
33References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2013 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Jun 2, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.