Liquid sealing material and electronic component using same
US9805998B2 · kind B2 · utility
4Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2013 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | May 15, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The purpose of the present invention is to provide: a liquid sealing material which has excellent PCT (pressure cooker test) resistance; and an electronic component which is obtained by sealing a part to be sealed with use of the liquid sealing material. A liquid sealing material of the present invention contains (A) a liquid epoxy resin, (B) a curing agent, (C) a silica filler and (D) a coupling agent, and is characterized in that the boron content in the silica filler (C) has an average of 1-50 ppm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.