MEMS microphone
US9807517B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2016 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Jan 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The MEMS microphone includes a first circuit board; a second circuit board keeping a distance from the first circuit board; a frame located between the first circuit board and the second circuit board for forming a cavity cooperatively with the first circuit board and the second circuit board, the frame including a plated-through-hole; an ASIC chip located in the cavity; and an MEMS chip having a back cavity. The first circuit board is electrically connected with the second circuit board by the plated-through-hole. The frame includes a conductive layer and an insulating layer, and the conductive layer is located between an inner surface of the frame and the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.