Method for making a multilayer flexible printed circuit board
US9807877B1 · kind B1 · utility
3Cited by
3References
8Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 5, 2016 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Oct 5, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible printed circuit board with multiple layers includes an inner wiring substrate and at least one outer wiring plate. Each outer wiring plate is connected to one surface of the inner wiring substrate, and defines at least one through hole which passes through the outer wiring plate to expose the inner wiring substrate. Each outer wiring plate further includes an adhesive plate connected to the inner wiring substrate. The adhesive plate includes a stepped portion extending towards a center of the through hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.