Pressure sensor
US9809447B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Jan 24, 2017 |
| Grant date | Nov 7, 2017 |
| Priority date | — |
| Expiry date | Jan 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the interface between the first substrate and the second substrate and further breaks out the interface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.