Method of making a current sensor and current sensor
US9810721B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2015 |
| Grant date | Nov 7, 2017 |
| Priority date | — |
| Expiry date | Jan 6, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a current sensor is described. The method includes providing a leadframe having a current conductor portion comprising two sections shaped such that a current to be measured flows in directions oriented obliquely or oppositely with respect to each other. Further, the method includes deforming the leadframe to lower the current conductor portion, and mounting an isolator on the current conductor portion. The method also includes mounting a semiconductor chip having a thickness of at least 0.2 mm and comprising two magnetic field sensors composed of four Hall sensors and magnetic field concentrators on the isolator, connecting the semiconductor chip and sensor terminal leads by wire bonds, packaging the semiconductor chip and parts of the leadframe in a plastic housing, and cutting a frame of the leadframe from current terminal leads and the sensor terminal leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.