Data center micro-module and data center formed by micro-modules
US9814162B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2015 |
| Grant date | Nov 7, 2017 |
| Priority date | — |
| Expiry date | Jun 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1497
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A data center micro-module includes: an enclosure, and a cabinet system, a power supply system, and a cooling system that are inside the enclosure. The cabinet system installs a computing server, the power supply system supplies power for the computing server and the cooling system, and the cooling system cools the computing server; and the enclosure is further externally provided with an interface configured to connect to another data center micro-module or connection apparatus. The foregoing data center micro-module integrates the power supply system, the cooling system and the computing server into a same module, and therefore can be directly manufactured in a factory. When a data center is built, the data center micro-modules only need to be combined and assembled, which greatly reduces a construction cycle of the data center, and the hardware architecture may be flexibly changed according to a specific deployment requirement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.