Lab-on-a-chip fabrication method and system
US9815054B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2014 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Nov 11, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2707/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for fabrication of a lab-on-a-chip system makes use of first and second mold parts, which are adapted to join each other to form a cavity to accommodate a positioning means and a support structure. The method includes receiving the chip in the positioning means, forming the cavity by joining the first and second mold parts, securing the chip with a fluid port of the chip to rest on the support structure for the support structure to mask the fluid port, introducing a molding material into the cavity to over-mold at least part of the chip and a volume extending away from the chip, separating the first and second mold parts, and extracting the chip from the mold. A fluid channel is formed by the support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.