Methods and systems for use in laser machining
US9815141B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2012 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Aug 17, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/389
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present embodiments providing methods, systems and apparatuses of protecting a surface during laser machining. In some embodiments, a method of protecting a surface during laser machining comprises: directing a fluid into a cavity of an object being laser machined, where the fluid does not have laser absorption properties; and directing a plurality of laser pulses at a wall of the object being laser machined, where the laser pulses are configured to form a hole through the wall such that at least one laser pulse passes through the hole and enters the cavity while the fluid is directed into the cavity such that the laser pulse is incident on the fluid and a surface together in order to inhibit backwall damage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.