Patent · US Active

Paste for joining components of electronic modules, system and method for applying the paste

US9815146B2 · kind B2 · utility

0Cited by

12References

16Claims

0Family size

Assignee

Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

Hermann Oppermann · Medway, US
Matthias Hutter · Berlin, DE
Christian Ehrhardt · Berlin, DE

Key dates

Filing date	Feb 28, 2012
Grant date	Nov 14, 2017
Priority date	—
Expiry date	Nov 30, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15787
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.