Method for joining substrates

US9815262B2 · kind B2 · utility

Assignees

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE
• Friedrich-Schiller-Universitat Jena · DE

Inventors

• Gerhard Kalkowski · Jena, DE
• Carolin Rothhardt · Jena, DE
• Mathias Rohde · Bad Klosterlausnitz, DE
• Ramona Eberhardt · Jena, DE

Key dates

• Filing date: Feb 21, 2012
• Grant date: Nov 14, 2017
• Expiry date: May 2, 2034

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C04B2237/704
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10−3 mbar.