Fluid ejection structure
US9815282B2 · kind B2 · utility
1Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2014 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Jun 30, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J29/377
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.