Processing 3D shaped transparent brittle substrate
US9815730B2 · kind B2 · utility
60Cited by
120References
44Claims
0Family size
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Key dates
| Filing date | Oct 31, 2014 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Feb 12, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.