Polyamide moulding composition and use thereof
US9815968B2 · kind B2 · utility
2Cited by
0References
12Claims
0Family size
Assignee
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Key dates
| Filing date | May 31, 2016 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | May 31, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic moulding composition, in particular a polyamide moulding composition, consisting of, by weight:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.