Patent · US Active

Polyester molding compounds with low TOC emission

US9815980B2 · kind B2 · utility

0Cited by
1References
17Claims
0Family size

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Inventors

Key dates

Filing dateMay 27, 2014
Grant dateNov 14, 2017
Priority date
Expiry dateMay 27, 2034

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2205/06
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

1. Thermoplastic molding composition comprising

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.