Plastic moulding compound and use thereof
US9815981B2 · kind B2 · utility
0Cited by
4References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2014 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Apr 26, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1352
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic, flame-retarded plastic molding compounds with improved mechanical properties, in particular for LDS applications, are described. The thermoplastic molding compound consists of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.