Plasma deposition process with removal of substrate tube
US9816178B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2014 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Jun 5, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/402
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a method of removing a substrate tube from the deposited layer inside of said substrate tube. In other words, the present invention relates to a method for manufacturing a precursor for a primary preform for optical fibers by means of an internal plasma deposition process, which method comprises the steps of providing a hollow substrate tube; creating a first plasma reaction zone having first reaction conditions in the interior of said hollow substrate tube by means of electromagnetic radiation for effecting the deposition of non-vitrified silica layers on the inner surface of said hollow substrate tube, and subsequently creating a second plasma reaction zone having second reaction conditions in the interior of said hollow substrate tube by means of electromagnetic radiation for effecting the deposition of vitrified silica layers on the non-vitrified silica layers deposited in the previous step; and removing the hollow substrate tube from the vitrified silica layers and the non-vitrified silica layers to obtain a deposited tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.