Patent · US Active

Micromechanical moisture sensor device, corresponding manufacturing method, and micromechanical sensor system

US9816953B2 · kind B2 · utility

1Cited by

4References

19Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jochen Franz · Reutlingen, DE
Uwe Schiller · Rötteln, DE

Key dates

Filing date	Jun 13, 2014
Grant date	Nov 14, 2017
Priority date	—
Expiry date	Nov 11, 2035

Classification

Technology area (CPC G)Physics
CPC primaryG01N27/048
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical moisture sensor device includes: a substrate having a front side and a rear side; an interdigital printed conductor track arrangement provided above and/or below the front side of the substrate; and a moisture-sensitive polymer layer situated above and in the gaps of the interdigital printed conductor track arrangement. The moisture-sensitive polymer layer extends below the front side into the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.