Single-chip magnetic field sensor bridge
US9817084B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 28, 2014 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | May 28, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R17/105
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A single-chip magnetic field sensor bridge, comprising a substrate, a reference arm, a sensing arm, shielding structures, and wire bond pads is disclosed. The reference arm and the sense arm respectively comprise at least two rows/columns of reference element strings and sense element strings formed by electrically connecting one or more identical magnetoresistive sensing elements. The reference element strings and the sense element strings are alternately arranged. The magnetoresistive sensing elements are AMR, GMR or TMR sensing elements. The reference element strings are provided with shielding structures thereon, and the sensing element strings are located in gaps between two adjacent shielding structures. The shielding structures are arrays of elongated strips composed of permalloy or another soft ferromagnetic material. The sensors can be implemented as one of three different bridge structures, called a quasi-bridge, a half-bridge, or a full-bridge. This single-chip magnetic field sensor bridge has the advantages of small size, low cost, high sensitivity, small offset, good linearity, and good temperature stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.