Apparatus and method for dynamic thermal management of integrated circuit
US9817454B2 · kind B2 · utility
2Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2015 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Feb 5, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A thermal control system for an integrated circuit in an electronic device includes a sensing unit, a calculating unit, and a control unit. The sensing unit is for providing a first temperature signal by sensing the temperature of the integrated circuit and providing a second temperature signal by sensing the temperature of a component of the electronic device. The calculating unit computes a target temperature value of the integrated circuit according to the second temperature signal. The control unit adjusts target setting for the integrated circuit according to the target temperature value and the first temperature signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.