Fingerprint identification module
US9818017B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 10, 2016 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | May 10, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V40/1324
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint identification module includes a cover plate, a fingerprint identification sensor, at least one light source, and a plurality of fibers. The cover plate has an inner surface and an outer surface opposite to the inner surface. The fingerprint identification sensor and the at least one light source are located under the inner surface, and the at least one light source is located adjacent to the fingerprint identification sensor. The fibers are arranged in an array and are located between the cover plate and the fingerprint identification sensor, wherein each of the fibers has a light incident surface. The light incident surface faces the inner surface and is inclined relative to the inner surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.