Apparatus for molecular adhesion bonding with compensation for radial misalignment
US9818614B2 · kind B2 · utility
8Cited by
4References
20Claims
0Family size
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Key dates
| Filing date | Aug 7, 2015 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Aug 7, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1092
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding a first wafer onto a second wafer by molecular adhesion where the wafers have an initial radial misalignment between them. The method includes bringing the two wafers into contact so as to initiate the propagation of a bonding wave between the two wafers while a predefined bonding curvature is imposed on at least one of the two wafers during the contacting step as a function of the initial radial misalignment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.