Printed circuit board assembly including conductive heat transfer
US9818669B2 · kind B2 · utility
3Cited by
18References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2014 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Sep 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly (PCBA) may include a printed circuit board (PCB), a socket mechanically and electrically coupled to the PCB, and an integrated circuit package electrically coupled to the socket. The PCBA also may include a thermal cover comprising a thermally conductive material and a thermal strap thermally coupled to the thermal cover. The thermal cover may be thermally coupled to the integrated circuit package and mechanically urge the integrated circuit package in contact with the socket, and the thermal strap may include a thermally conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.