Wiring substrate
US9818681B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 15, 2015 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Mar 2, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring substrate includes a first substrate and an electronic component mounted on an upper surface of the first substrate. A first pad is formed on an uppermost wiring layer of the first substrate. A connection terminal is formed on the electronic component and is located proximate to the first pad in a plan view. The wiring substrate further includes a connection member formed on the first pad to electrically connect the first pad and the connection terminal. The connection member includes a rod-shaped core and a solder layer, which is coated around the core and joined to the first pad. The solder layer includes a bulge that spreads from the core of the connection member in a planar direction. The bulge is joined to the connection terminal of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.