Enhanced cleaning for water-soluble flux soldering
US9818717B2 · kind B2 · utility
1Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2016 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Feb 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/81948
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An approach to provide an electronic assembly process that includes receiving at least one electronic assembly after a solder reflow process using a Sn-containing solder and a water-soluble flux. The approach includes baking the at least one electronic assembly in an oxygen containing environment and, then cleaning the at least one electronic assembly in an aqueous cleaning process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.