Optoelectronic semiconductor component
US9818921B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2011 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Jan 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.