Patent · US Active

Optoelectronic semiconductor component

US9818921B2 · kind B2 · utility

2Cited by
2References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 10, 2011
Grant dateNov 14, 2017
Priority date
Expiry dateJan 24, 2033

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/857
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.