Optoelectronic assembly and method for producing an optoelectronic assembly

US9818982B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Daniel Riedel · Hersbruck, DE
• Thomas Wehlus · Lappersdorf, DE
• Nina Riegel · Tegernheim, DE
• Silke Scharner · Regensburg, DE
• Johannes Rosenberger · Regensburg, DE
• Arne Fleissner · Regensburg, DE

Key dates

• Filing date: Jul 3, 2015
• Grant date: Nov 14, 2017
• Expiry date: Jul 3, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02E10/549
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

An optoelectronic assembly includes an optoelectronic component having a surface light source for emitting a light on a substrate which is at least partly transmissive for the light emitted by the surface light source, wherein the optoelectronic component includes at least one first main emission surface and a second main emission surface wherein the second main emission surface is situated opposite the first main emission surface, and a reflective structure which is arranged at least partly in the beam path of the light emitted by the surface light source and is designed to reflect at least part of the light impinging on the reflective structure in the direction of the substrate, such that a laterally offset image of the surface light source is generatable. The reflective structure and the optoelectronic component are arranged at a distance from one another in a range of approximately 1 mm to approximately 1000 mm.