Thermal solutions for system-in-package assemblies in portable electronic devices
US9820373B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2014 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Feb 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A compact portable electronic device packaged into a System-in-Package assembly and thermal solutions for the device is disclosed. The compact portable electronic device can be assembled into a single package to reduce size and enhance form factor. Several tens or hundreds of components including multiple dies, passive components, mechanical or optical components can be packaged into a single system on a printed circuit board. One or more of the components can dissipate a lot of power resulting in the generation of excess heat. To remove the excess heat, the device can include one or more thermal solutions such as internal thermal plugs, heat spreaders, internal embedded heat sinks, and/or external heat sinks. In some examples, the thermal solutions can dissipate heat via conduction to the bottom of the substrate or via convection to the top of the system or a combination of both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.