Patent · US Active

Rigid-flex module and manufacturing method

US9820375B2 · kind B2 · utility

0Cited by

3References

8Claims

0Family size

Assignee

GE Embedded Electronics Oy · FI

Inventors

Antti Iihola · Helsinki, FI
Tuomas Waris · Helsinki, FI

Key dates

Filing date	Jan 17, 2017
Grant date	Nov 14, 2017
Priority date	—
Expiry date	Jan 17, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/308
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.