Laser cutting method
US9821409B2 · kind B2 · utility
1Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2012 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Dec 14, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/38
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser cutting method and a laser cutting apparatus cut a metallic work with a laser beam of a one-micrometer waveband. The method and apparatus carry out the laser cutting of the work with a ring beam RB passed through a focus position of a condenser lens 13 and having inner and outer diameters that tend to expand. The outer diameter of the ring beam is in a range of 300 μm (micrometers) to 600 μm, an inner diameter ratio of the same is in a range of 30 % to 70 %, and a focal depth of the condenser lens is in a range of 2 mm to 5 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.