Polyamide acid and resin composition containing same
US9822281B2 · kind B2 · utility
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2References
4Claims
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Key dates
| Filing date | Aug 1, 2016 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Aug 1, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2150/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1):wherein δ represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.