Wafer testing probe card
US9823272B2 · kind B2 · utility
2Cited by
0References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2014 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Jan 22, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07314
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.