Patent · US Active

Probe tip formation for die sort and test

US9823273B2 · kind B2 · utility

4Cited by

5References

21Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Keith J. Martin · Hillsboro, US
Kip P. Stevenson · Portland, US
Kamil Salloum · Tempe, US
Todd P. Albertson · Warren, US

Key dates

Filing date	Jun 29, 2013
Grant date	Nov 21, 2017
Priority date	—
Expiry date	Mar 8, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49124
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.