Heat dissipation apparatus and electronic device
US9823716B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2016 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Mar 30, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Disclosed is a heat dissipation apparatus and an electronic device. The heat dissipation apparatus is suitable for a processor in an electronic device. The heat dissipation apparatus includes a housing including an inlet for introducing a cooling fluid into the housing and an outlet for allowing the cooling fluid to exit from the housing. The heat dissipation apparatus includes a heat dissipating member disposed in the housing. The heat dissipation apparatus includes a buffer member disposed between the inlet and the heat dissipating member. The buffer member includes through-holes for inhibiting a flow of the cooling liquid from the inlet of the housing to the dissipating member to transfer heat across the heat dissipating member to the cooling fluid. The electronic device may include a processor and the heat dissipation apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.