Pad sharing for contact sensor and bolometer with temperature compensation in heat-assisted magnetic recording device
US9824705B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2016 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Dec 6, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A slider of a heat-assisted recording head comprises electrical bond pads coupled to bias sources and a ground pad, an air bearing surface, and a waveguide configured to receive light from a laser source. A contact sensor proximate the air bearing surface is coupled between a first bond pad and a second bond pad. A bolometer is coupled to a reference thermal sensor. The bolometer is situated at a slider location that receives at least some of the light communicated along the waveguide. The reference thermal sensor is situated at a slider location unexposed to the light communicated along the waveguide. The bolometer and reference thermal sensor are coupled between the first and second bond pads and in parallel with the contact sensor. A ground connection is coupled to the ground pad and at a connection between the bolometer and the reference thermal sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.