Magnetic field programming of electronic devices on a wafer
US9824774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2015 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Jun 29, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C11/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for programming integrated circuit (IC) dies formed on a wafer includes a magnetic field transmitter that outputs a digital test program as a magnetic signal. At least one digital magnetic sensor (e.g., Hall effect sensor) is formed with the IC dies on the wafer. The digital magnetic sensor detects and receives the magnetic signal. A processor formed on the wafer converts the magnetic signal to the digital test program and the digital test program is stored in memory on the wafer in association with one of the IC dies. The magnetic field transmitter does not physically contact the dies, but can flood an entire surface of the wafer with the magnetic signal so that all of the IC dies are concurrently programmed with the digital test program.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.