Resistor element and method of manufacturing the same
US9824798B2 · kind B2 · utility
0Cited by
16References
19Claims
0Family size
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Key dates
| Filing date | Nov 30, 2015 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Nov 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/281
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.