Printed circuit module having semiconductor device with a polymer substrate and methods of manufacturing the same
US9824951B2 · kind B2 · utility
167Cited by
56References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2015 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Sep 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit module and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and a buried oxide (BOX) layer over the at least one device layer. A polymer layer is disposed over the BOX layer, wherein the polymer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 103 Ohm-cm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.