Mounting and environmental protection device for an IGBT module
US9824953B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 2016 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | May 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module is disclosed. The semiconductor module may include a housing having a sidewall portion, a housing support plate coupled to a bottom surface of the sidewall portion such that the housing support plate and the sidewall portion define an interior space of the housing of the semiconductor module, and a semiconductor device disposed within the interior space and fixedly coupled to the housing. The semiconductor module may further include a cover member fixedly attached to a top surface of the sidewall portion such that the cover member, the housing and the housing support plate form a protective enclosure for the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.