Patent · US Active

Flexible circuit leads in packaging for radio frequency devices

US9824995B2 · kind B2 · utility

2Cited by
12References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 29, 2014
Grant dateNov 21, 2017
Priority date—
Expiry dateSep 29, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/30111
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A packaged RF device is provided that utilizes flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.