Compact camera module arrangements that facilitate dam-and-fill and similar encapsulation techniques
US9826131B2 · kind B2 · utility
5Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2014 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Sep 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Compact camera module can include auxiliary spacers to facilitate use of dam-and-fill encapsulation techniques. An encapsulant disposed on side edges of the auxiliary spacer can close off a gap between the auxiliary spacer and a support on which an image sensor is mounted so as to substantially seal off an area in which bond wires or other components are located. In some cases, the thickness of a transmissive substrate in the module can be reduced near its periphery to provide more head room for the bond wires, which can result in a smaller overall footprint for the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.