Hot melt adhesive application method and hot melt adhesive application device
US9827579B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2013 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Dec 16, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D5/10
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
In front view of the application nozzle, all of the pressurized air flow K and adhesive flow H are made to run parallel to each other in the vertical direction.Of the pressurized air flows K from the pressurized air hole b in the pressurized air plate, the two that are located on one side of the adhesive hole opening a and from a pair in the front-to-back direction are tilted so as to approach each other.The extension lines thereof are located on the side of the adhesive bead, which results from the adhesive flow discharged from the adhesive hole opening, and have directions that converge.The respective pressurized air flows on the two side of the adhesive bead are made to flow downward while uniting in the direction of convergence.A web in which the adhesive bead is elongated while being swung in the transverse direction is formed and, near the bottom surface of the application nozzle, a non-interference space Q is formed between the adhesive bead and the fore pressurized air flow.The adhesive bead, resulting from the adhesive flow discharged from the adhesive hole opening, and the pressurized air flows do not interfere with each other and walls R of pressurized air flows are form…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.