Diamond composite cutting tool assembled with tungsten carbide
US9827611B2 · kind B2 · utility
0Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2015 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Jan 30, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2005/001
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A tool and a method of making the tool are disclosed. The tool includes a superabrasive compact, for example, a volume of silicon carbide diamond bonded composite, directly bonded to a tungsten carbide body during sintering. The green body may have a recess with a complementary shape to the superabrasive compact, whereby after inserting at least a part of the superabrasive compact within the recess and sintering, the tungsten carbide body and the recess shrink to form an interference fit therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.