Heat de-bondable optical articles
US9827739B2 · kind B2 · utility
1Cited by
54References
21Claims
0Family size
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Key dates
| Filing date | Jul 1, 2013 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Nov 6, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24843
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Heat de-bondable optical articles include two optical substrates and a heat de-bondable adhesive article disposed between them. The adhesive article includes a heat-shrinkable substrate and an optically clear adhesive proximate to the heat-shrinkable substrate. Optical articles can be prepared by disposing the heat-shrinkable substrate and the optically clear adhesive between two optical substrates. The optically clear adhesive covers a majority of the surface area of the optical substrates, and the heat-shrinkable substrate is located near the edge of the optical substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.