Patent · US Active

Jig assembly, laminating apparatus, and laminating method using the laminating apparatus

US9827753B2 · kind B2 · utility

3Cited by
3References
12Claims
0Family size

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Key dates

Filing dateJul 22, 2013
Grant dateNov 28, 2017
Priority date
Expiry dateSep 5, 2033

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02F1/133305
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Provided are laminating apparatus and method. A laminating apparatus includes a jig assembly, which includes the first jig and an elastic member, and a second jig. A laminating method includes placing a first plate on a jig assembly, placing a second plate on a second jig which is placed to face the first jig, bringing the second plate into contact with the adhesive layer by making the jig assembly and the second jig approach each other, and, attaching the first plate and the second plate to each other by making the jig assembly and the second jig approach closer to each other. The jig assembly includes a first jig and an elastic member which comprises a top portion and sloping portions sloping downward from the top portion. An adhesive layer is disposed between the first plate and the second plate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.